PENANG, Malaysia and REGENSBURG, Germany – Osram Opto Semiconductors announced plans to increase production at its LED chip manufacturing facilities here, expanding production of 6-inch wafers instead of the current 4-inch wafers, which is expected to nearly double the company's chip production capacity for white LEDs by the end of 2012. At the Penang site, a new production building is under construction. In Regensburg, existing space is being reallocated. The capacity expansion will primarily affect InGaN chips employing thin-film and UX:3 technology.
Osram Opto Semiconductors said the move to 6-inch wafers targets the potential of international LED markets.
For more information, please visit www.osram-os.com.
